AT&S, an Austria-based printed circuit board and IC substrate maker, hopes investment and technology upgrade in its Shanghai and Chongqing plants will improve its profitability, Chief Executive Andreas Gerstenmayer said yesterday in Shanghai.
AT&S plans to produce 50,000-80,000 square meters of integrated circuit substrate annually in China after the Chongqing plant reaches maximum capacity. Hopefully this will help cut reliance on imports.
IC substrate, which connects chips and PCBs, is widely used in smartphones, intelligent automotives, industrial and medical industries.
AT&S is upgrading technologies in the two plants, which will offer advanced products that manages energy efficiently in smart devices.
AT&S invested 455.3 million euros (7 million) in the Chongqing facility in the fiscal year ended in March.